Electronic modulating device

ABSTRACT

An electronic modulating device is provided. The electronic modulating device includes a first substrate. The first substrate includes a first portion and a second portion. The electronic modulating device also includes a second substrate disposed opposite to the first substrate. The electronic modulating device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps the first portion and does not overlap the second portion. In addition, the electronic modulating device includes a first adjustment unit disposed between the first portion of the first substrate and the second substrate. The first adjustment unit has a first elastic coefficient. The electronic modulating device also includes second adjustment unit disposed between the second portion of the first substrate and the second substrate. The second adjustment unit has a second elastic coefficient that is greater than the first elastic coefficient.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority of China Patent Application No.201811465528.0, filed on Dec. 3, 2018. This application also claims thebenefit of priority from a provisional application of U.S. PatentApplication No. 62/688,457 filed on Jun. 22, 2018, the entireties ofwhich are incorporated by reference herein.

BACKGROUND Technical Field

The present disclosure relates to an electronic modulating device, andin particular to an electronic modulating device that includesadjustment units.

Description of the Related Art

Electronic products, such as smartphones, tablets, notebooks, monitors,and TVs, have become indispensable necessities in modern society. Withthe flourishing development of such portable electronic products,consumers have high expectations regarding the quality, functionality,or price of such products. These electronic products are often used aselectronic modulating devices, for modulating electromagnetic waves.However, a new electronic modulating device that is suitable for use ina variety of surroundings is needed.

SUMMARY

In accordance with some embodiments of the present disclosure, anelectronic modulating device is provided. The electronic modulatingdevice includes a first substrate. The first substrate includes a firstportion and a second portion. The electronic modulating device alsoincludes a second substrate disposed opposite the first substrate. Theelectronic modulating device further includes at least one workingdevice disposed between the first substrate and the second substrate,wherein the working device overlaps the first portion and does notoverlap the second portion. In addition, the electronic modulatingdevice includes a first adjustment unit disposed between the firstportion of the first substrate and the second substrate. The firstadjustment unit has a first elastic coefficient. The electronicmodulating device also includes a second adjustment unit disposedbetween the second portion of the first substrate and the secondsubstrate. The second adjustment unit has a second elastic coefficientthat is greater than the first elastic coefficient.

In accordance with some embodiments of the present disclosure, anelectronic modulating device is provided. The electronic modulatingdevice includes a first substrate. The first substrate includes a firstportion and a second portion. The electronic modulating device alsoincludes a second substrate disposed opposite the first substrate. Theelectronic modulating device further includes at least one workingdevice disposed between the first substrate and the second substrate,wherein the working device overlaps the first portion and does notoverlap the second portion. In addition, the electronic modulatingdevice includes a first adjustment unit disposed between the firstportion of the first substrate and the second substrate. The firstadjustment unit has a first thickness. The electronic modulating devicealso includes second adjustment unit disposed between the second portionof the first substrate and the second substrate. The second adjustmentunit has a second thickness. The first thickness is less than the secondthickness.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be understood by reading the subsequent detaileddescription and examples with references made to the accompanyingdrawings, wherein:

FIG. 1 illustrates a top view of an electronic modulating device inaccordance with some embodiments of the present disclosure.

FIG. 2 illustrates an enlarged view of region A of the electronicmodulating device in accordance with some embodiments of the presentdisclosure.

FIGS. 3A and 3B illustrate cross-sectional views of different stages ofa process for manufacturing the electronic modulating device inaccordance with some embodiments of the present disclosure.

FIG. 4 illustrates a cross-sectional view of an electronic modulatingdevice in accordance with some embodiments of the present disclosure.

FIGS. 5A and 5B illustrate cross-sectional views of different stages ofa process for manufacturing the electronic modulating device inaccordance with some embodiments of the present disclosure.

FIG. 6 illustrates a cross-sectional view of the electronic modulatingdevice in accordance with some embodiments of the present disclosure.

FIG. 7 illustrates a cross-sectional view of an electronic modulatingdevice in accordance with some embodiments of the present disclosure.

FIGS. 8A and 8B illustrate cross-sectional views of the first portionand the second portion of the electronic modulating device in accordancewith some embodiments of the present disclosure.

DETAILED DESCRIPTION

The electronic modulating device of the present disclosure and themanufacturing method thereof are described in detail in the followingdescription. In the following detailed description, for purposes ofexplanation, numerous specific details and embodiments are set forth inorder to provide a thorough understanding of the present disclosure. Itwill be apparent, however, that the exemplary embodiments set forthherein are used merely for the purpose of illustration, and theinventive concept may be embodied in various forms without being limitedto those exemplary embodiments. In addition, the drawings of differentembodiments may use like and/or corresponding numerals to denote likeand/or corresponding elements. However, the use of like and/orcorresponding numerals in the drawings of different embodiments does notsuggest any correlation between different embodiments. In addition, inthis specification, expressions such as “first material layer disposedabove/on/over a second material layer”, may indicate the direct contactof the first material layer and the second material layer, or it mayindicate a non-contact state with one or more intermediate layersbetween the first material layer and the second material layer. In theabove situation, the first material layer may not be in direct contactwith the second material layer.

In addition, in this specification, relative expressions are used. Forexample, “upper” or “lower” is used to describe the position of oneelement relative to another. It should be appreciated that if a deviceis flipped upside down, an element that is on the “bottom” will becomean element that is on the “top”.

It should be understood that, although the terms first, second, thirdetc. may be used herein to describe various elements, components,regions, layers, portions and/or sections, these elements, components,regions, layers, portions and/or sections should not be limited by theseterms. These terms are only used to distinguish one element, component,region, layer, portion or section from another element, component,region, layer or section. Thus, a first element, component, region,layer, portion or section discussed below could be termed a secondelement, component, region, layer, portion or section without departingfrom the teachings of the present disclosure.

It should be understood that this description of the exemplaryembodiments is intended to be read in connection with the accompanyingdrawings, which are to be considered part of the entire writtendescription. The drawings are not drawn to scale. In addition,structures and devices are shown schematically in order to simplify thedrawing. In the drawings, some components may be omitted for clarity.Moreover, some components in the drawings may be eliminated as anotherembodiment of the present disclosure.

The terms “about” and “substantially” typically mean +/−20% of thestated value, +/−10% of the stated value, +/−5% of the stated value,+/−3% of the stated value, +/−2% of the stated value, +/−1% of thestated value or +/−0.5% of the stated value. The stated value of thepresent disclosure is an approximate value. When there is no specificdescription, the stated value includes the meaning of “about” or“substantially”. Moreover, when considering the deviation or thefluctuation of the manufacturing process, the term “same” may alsoinclude the meaning of “about” or “substantially”.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure belongs. It should be appreciated that,in each case, the term, which is defined in a commonly used dictionary,should be interpreted as having a meaning that conforms to the relativeskills of the present disclosure and the background or the context ofthe present disclosure, and should not be interpreted in an idealized oroverly formal manner unless so defined.

The term “substrate” may include elements and films that are alreadyformed on the substrate, and may include a plurality of active elements,such as transistors. For brevity, it is illustrated in a platesubstrate.

In addition, in some embodiments of the present disclosure, termsconcerning attachments, coupling and the like, such as “connected” and“interconnected,” refer to a relationship wherein structures are securedor attached to one another either directly or indirectly throughintervening structures, as well as both movable or rigid attachments orrelationships, unless expressly described otherwise.

In addition, the phrase “in a range from a first value to a secondvalue” indicates the range includes the first value, the second value,and other values in between.

In addition, the term “cover” includes the meaning of “cover partially”or “cover completely”.

Refer to FIG. 1, which illustrates a top view of an electronicmodulating device 100 in accordance with some embodiments of the presentdisclosure. The electronic modulating device 100 may include a workingregion 100A and a non-working region 100B as shown in FIG. 1. Theworking region 100A may include a working device (shown in FIG. 8A). Thenon-working region 100B may be adjacent to the working region 100A. Theelectronic modulating device 100 may include an integrated circuit (IC)therein. The IC may include various passive and active microelectronicdevices, such as thin film resistors, other capacitors (e.g.metal-insulator-metal capacitor, MIMCAP), inductors, diodes,metal-oxide-semiconductor field effect transistors (MOSFETs),complementary MOS (CMOS) transistors, bipolar junction transistors(BJTs), laterally diffused MOS (LDMOS) transistors, high power MOStransistors, and other types of transistors.

Refer to FIG. 2, which illustrates an enlarged view of region A of theelectronic modulating device 100 in accordance with some embodiments ofthe present disclosure. As shown in FIG. 2A, the working region 100A mayinclude a plurality of first portions 10 and a plurality of secondportions 20. In some embodiments, there is at least one working devicein the first portion 10. The first portion 10 may be a M×N array,wherein M and N are positive integers. However, the scope of thedisclosure is not intended to be limited. The second portion 20 may beadjacent to the first portion 10. For example, the second portion 20 maybe disposed in a region between two first portions 10, have an arbitrarysize, and be arranged in an arbitrary way. In some embodiments, theremay be no working device in the second portion 20. In some embodiments,the adjustment unit (shown in FIG. 3B) that has less recovering forceper unit area may be disposed on the first portion 10; the adjustmentunit (shown in FIG. 3B) that has greater recovering force per unit areamay be disposed on the second portion 20.

Refer to FIG. 1, the non-working region 100B may have a plurality ofsecond portion 20. The second portion 20 may have an arbitrary size, andbe arranged in an arbitrary way. However, the scope of the disclosure isnot intended to be limited.

Refer to FIGS. 3A and 3B, which illustrate cross-sectional views ofdifferent stages of a process for manufacturing the electronicmodulating device 100 in accordance with some embodiments of the presentdisclosure. The cross-sectional view of FIG. 3A corresponds to line R-R′of the working region 100A of FIG. 2. As shown in FIG. 3A, a firstsubstrate 102 is provided. It should be appreciated that the firstsubstrate 102 may include a plurality of layers and various elementsformed in and/or on them. For brevity, the first substrate 102 isillustrated in one layer. There is at least one working device disposedon the region of the first substrate 102 corresponding to the firstportion 10. There may be no working device on the region of the firstsubstrate 102 corresponding to the second portion 20.

As shown in FIG. 3A, at least one adjustment unit 104 is disposed on thefirst portion 10 of the first substrate 102, and at least one adjustmentunit 106 is disposed on the second portion 20 of the first substrate102. In some embodiments, the material of the adjustment unit 104 and/oradjustment unit 106 may include, but is not limited to, photoresist oranother suitable material. In some embodiments, the adjustment unit 104and/or the adjustment unit 106 may have a rectangle shape in top view.The adjustment unit 104 and/or adjustment unit 106 may be arranged inone or more directions. There is a gap between two adjacent adjustmentunits 104 and/or adjustment units 106 so that a modulating materiallayer 110, shown in FIG. 3B, may flow therein. In this embodiment, theadjustment unit 104 and the adjustment unit 106 may be a spacer formedby photoresist, respectively. The adjustment unit 104 and the adjustmentunit 106 may have a thickness H₁. In the present disclosure, thethickness and/or height may be measured in central region along thenormal direction of the first substrate 102. The thickness and/or heightmay be a single value or an average of multiple values. In someembodiments, the thickness and/or height may be a maximum thicknessand/or height measured. In some embodiments, the adjustment unit 104 hasa first elastic coefficient K₁, and the adjustment unit 106 has a secondelastic coefficient K₂. The second elastic coefficient K₂ is greaterthan the first elastic coefficient K₁. In the present disclosure, theelastic coefficient may indicate spring constant whose unit is N/m. Theelastic coefficient may also indicate Young's modulus whose unit isN/m². In this embodiment, the material of the adjustment unit 104 may bethe same as that of the adjustment unit 106, but the densities of themmay be different. In some embodiments, the density of the adjustmentunit 106 may be greater than that of the adjustment unit 104 so that theelastic coefficient of the adjustment unit 106 is greater than that ofthe adjustment unit 104. However, the scope of the disclosure is notintended to be limited. In other embodiments, the material of theadjustment unit 104 may be different from that of the adjustment unit106. For example, the adjustment unit 104 and the adjustment unit 106may be formed by two photoresists that are made by different species sothat the adjustment unit 104 and the adjustment unit 106 may havedifferent elastic coefficients. In addition, other methods may be usedto differentiate the elastic coefficients of the adjustment unit 104 andthe adjustment unit 106.

In some embodiments, a plurality of adjustment units 108 are disposed onthe first portion 10 and/or the second portion 20 of the first substrate102. The material of the adjustment unit 108 may include, but is notlimited to, photoresist or another suitable material. As shown in FIG.3A, the adjustment unit 108 may have the thickness H₂. In someembodiments, the adjustment unit 108 may have third elastic coefficientK₃. The third elastic coefficient K₃ may be greater than the secondelastic coefficient K₂. In some embodiments, at least one adjustmentunit 108 may be disposed between the adjustment unit 104 and theadjustment unit 106. The adjustment unit 104 may be disposed between twoadjacent adjustment units 108; the adjustment unit 106 may be disposedbetween two adjacent adjustment units 108. As shown in FIG. 3A, there isa thickness difference X₁ between the adjustment unit 104 and theadjustment unit 108, and there is the thickness difference X₁ betweenthe adjustment unit 106 and the adjustment unit 108.

In some embodiments, the adjustment unit 104, the adjustment unit 106and the adjustment unit 108 may have different size, such as differentarea or shape of top surface, or different area or shape of sidesurface.

Next, as shown in FIG. 3B, a second substrate 112 is disposed on thefirst substrate 102 so that the adjustment unit 104 and the adjustmentunit 106 are compressed. As a result, the electronic modulating device100 is created. As shown in FIG. 3B, the adjustment unit 104 a, theadjustment unit 106 a and the adjustment unit 108 are disposed betweenthe first substrate 102 and the second substrate 112. In addition, theadjustment unit 104 a, the adjustment unit 106 a and the adjustment unit108 may have the thickness H₂′. The thickness H₂′ may be less than orequal to the thickness H₂. In some embodiments, the electronicmodulating device 100 may include the modulating material layer 110. Themodulating material layer 110 is disposed between the first substrate102 and the second substrate 112. The material of the modulatingmaterial layer 110 may include, but is not limited to, liquid crystal oranother suitable modulating material.

It should be appreciated that the second substrate 112 may include aplurality of layers and various elements formed in and/or on them. Forbrevity, the second substrate 112 is illustrated in one layer. In someembodiments, the second substrate 112 may have at least one flexiblefilm so that the second substrate 112 would have a bumpy or obliquesurface.

In some embodiments, the distances between the first substrate 102 andthe second substrate 112 that are in different regions are substantiallyequal. For example, the distance between the first portion 10 of thefirst substrate 102 and the second substrate 112 is D₁, and the distancebetween the second portion 20 of the first substrate 102 and the secondsubstrate 112 is also D₁. As shown in FIGS. 3A and 3B, there is thethickness difference X₁ between the compressed adjustment unit 104 a andthe adjustment unit 104 not compressed; there is the thicknessdifference X₁ between the compressed adjustment unit 106 a and theadjustment unit 106 not compressed. In this embodiment, the adjustmentunit 108 is substantially not compressed. The compressed adjustment unit104 a and adjustment unit 106 a may have first recovering force F₁ andsecond recovering force F₂, respectively. The recovering force mentionedherein may indicate elastic force. The first recovering force F₁ and thesecond recovering force F₂ may fit Hooke's law as shown below:

F=−KΔX   equation (1)

In equation (1), K indicates elastic coefficient, and ΔX indicates thelength or thickness that is compressed. Negative sign means that thedirection of the recovering force may be different from that ofcompression or stretch.

In this embodiment, F₁=K₁X₁, and F₂=−K₂X₁. Namely, the recovering forceof the adjustment unit 104 a may substantially be equal to K₁X₁, and therecovering force of the adjustment unit 106 a may substantially be equalto K₂X₁. Since the compressed length of the adjustment unit 104 a issubstantially the same as that of the adjustment unit 106 a, therecovering force of the adjustment unit 104 a and the adjustment unit106 a may be dependent on their elastic coefficients. As the secondelastic coefficient K₂ of the adjustment unit 106 a is greater than thefirst elastic coefficient K₁ of the adjustment unit 104 a, the secondrecovering force F₂ is greater than the first recovering force F₁. Itshould be appreciated that the direction of the recovering force shownin FIG. 3B is merely exemplary, and the direction of the recoveringforce generated by the adjustment unit 104 a and the adjustment unit 106a may not be limited to one direction. In some embodiments, thedirection of the first recovering forces F₁ and the second recoveringforce F₂ may be the same as the normal direction of the first substrate102. In addition, the recovering force generated by the adjustment unit108 is equal to 0 because the compressed length of the adjustment unit108 is substantially equal to 0.

Refer to FIG. 4, which illustrates a cross-sectional view of theelectronic modulating device 100′ in accordance with some embodiments ofthe present disclosure. The electronic modulating device 100 becomes theelectronic modulating device 100′ when its volume changes. As mentionedabove, the second recovering force F₂ may be greater than the firstrecovering force F₁. Therefore, the recovering force pushing on theregion of the second substrate 112 that corresponds to the secondportion 20 is greater than that corresponds to the first portion 10. Asa result, the distance between the first substrate 102 and the secondsubstrate 112 that corresponds to the first portion 10 may be thedistance Z₁ plus the thickness H₂, and the distance between the firstsubstrate 102 and the second substrate 112 that corresponds to thesecond portion 20 may be the distance Z₂ plus the thickness H₂. The sumof the distance Z₁ and the thickness H₂ is less than that of thedistance Z₂ and the thickness H₂. The distance Z₁ may less than thedistance Z₂. In other embodiments, the adjustment unit 104 b may havethe thickness H₃, and the adjustment unit 106 b may have the thicknessH₄. As shown in FIG. 4, the thickness H₄ may be greater than thethickness H₃. In this embodiment, the distance between the firstsubstrate 102 and the second substrate 112 that corresponds to the firstportion 10 is substantially equal to the thickness H₃, and the distancebetween the first substrate 102 and the second substrate 112 thatcorresponds to the second portion 20 is substantially equal to thethickness H₄.

In some cases, deformation of the second substrate 112 may occur due tothe volume change of the electronic modulating device heated so that thedistance between the first substrate 102 and the second substrate 112would increase. As a result, the capacitance of the electronicmodulating device may change, which influences the performance of theelectronic modulating device. In this embodiment, the adjustment unit104, having less elastic coefficient, is disposed on the first portion10 on which the working device is disposed; the adjustment unit 106,having greater elastic coefficient, is disposed on the second portion 20on which the no working device is disposed. As shown in FIG. 4, when thevolume of the electronic modulating device changes due to heat, thedistance difference between the first portion 10 of the first substrate102 and the second substrate 112 is less than that between the secondportion 20 of the first substrate 102 and the second substrate 112.Namely, the region on which the working device is disposed has lessdistance difference. Therefore, the working device is stable whentemperature changes, thereby improving the reliability of the electronicmodulating device 100.

Many variations and/or modifications can be made to embodiments of thedisclosure. Refer to FIGS. 5A and 5B, which illustrate cross-sectionalviews of different stages of a process for manufacturing the electronicmodulating device in accordance with some embodiments of the presentdisclosure. The structure of FIG. 5A may be the same as or similar tothat of FIG. 3A, and one of the differences is that the adjustment units104 are replaced by adjustment units 204, and the adjustment units 106are replaced by adjustment units 206. In some embodiments, the materialof the adjustment unit 204 may be the same as that of the adjustmentunit 206, and the density of the adjustment unit 204 may be the same asthat of the adjustment unit 206. Therefore, the adjustment unit 204 andthe adjustment unit 206 may substantially have the same elasticcoefficient. In some embodiments, the adjustment unit 204 and theadjustment unit 206 have fourth elastic coefficient K₄. As shown in FIG.5A, the adjustment unit 204 may have the thickness H₅, and theadjustment unit 204 may have the thickness H₆. The thickness H₆ isgreater than the thickness H₅. In addition, the adjustment unit 108 mayhave the thickness H₇, and may have third elastic coefficient K₃ that isgreater than the fourth elastic coefficient K₄. As shown in FIG. 5A,there is a thickness difference X₃ between the adjustment unit 204 andthe adjustment unit 108, and there is a thickness difference X₄ betweenthe adjustment unit 206 and the adjustment unit 108. The thicknessdifference X₄ may be greater than the thickness difference X₃. In someembodiments, the adjustment unit 204, the adjustment unit 206 and theadjustment unit 108 may have different size, such as different area orshape of top surface, or different area or shape of side surface.

Next, as shown in FIG. 5B, the modulating material layer 110 is filledon the first substrate 102 and the second substrate 112 is disposed onthe first substrate 102 so that the adjustment unit 204 and theadjustment unit 206 are compressed. As a result, the electronicmodulating device 200 is created. As shown in FIG. 5B, the adjustmentunit 204 a, the adjustment unit 206 a, the adjustment unit 108 and themodulating material layer 110 are disposed between the first substrate102 and the second substrate 112. Moreover, the adjustment unit 204 a,the adjustment unit 206 a and the adjustment unit 108 may have thethickness H₇′. The thickness H₇′ is less than or equal to the thicknessH₇.

In some embodiments, in the electronic modulating device 200, thedistances between the first substrate 102 and the second substrate 112that are in different regions are substantially equal. For example, thedistance between the first portion 10 of the first substrate 102 and thesecond substrate 112 is D₂, and the distance between the second portion20 of the first substrate 102 and the second substrate 112 is also D₂.As shown in FIGS. 5A and 5B, there is the thickness difference X₃between the compressed adjustment unit 204 a and the adjustment unit 204not compressed; there is the thickness difference X₄ between thecompressed adjustment unit 206 a and the adjustment unit 206 notcompressed. In this embodiment, the adjustment unit 108 is substantiallynot compressed. The compressed adjustment unit 204 a and adjustment unit206 a may have third recovering force F₃ and fourth recovering force F₄,respectively. The third recovering force F₃ and the fourth recoveringforce F₄ may fit Hooke's law. In this embodiment, F₃=K₄X₃, and F₄=−K₄X₄.Namely, the recovering force of the adjustment unit 204 a maysubstantially be equal to K₄X₃, and the recovering force of theadjustment unit 206 a may substantially be equal to K₄X₄. Since theelastic coefficient of the adjustment unit 204 a is substantially thesame as that of the adjustment unit 206 a, the recovering force of theadjustment unit 204 a and the adjustment unit 206 a may be dependent ontheir compressed length. As the thickness difference X₄ is greater thanthe thickness difference X₃, the fourth recovering force F₄ is greaterthan the third recovering force F₃. It should be appreciated that thethird recovering force F₃ and/or the fourth recovering force F₄ in FIG.5B is merely exemplary. In fact, the direction of the recovering forcegenerated by the adjustment unit 204 a and the adjustment unit 206 a maynot be limited to one direction. In some embodiments, the direction ofthe third recovering force F₃ and the fourth recovering force F₄ may bethe same as the normal direction of the first substrate 102.

Refer to FIG. 6, which illustrates a cross-sectional view of theelectronic modulating device 200′ in accordance with some embodiments ofthe present disclosure. The electronic modulating device 200 becomes theelectronic modulating device 200′ when its volume expands. As mentionedabove, the fourth recovering force F₄ may be greater than the thirdrecovering force F₃. Therefore, the recovering force pushing on theregion of the second substrate 112 that corresponds to the secondportion 20 is greater than that corresponds to the first portion 10. Asa result, the distance between the first substrate 102 and the secondsubstrate 112 that corresponds to the first portion 10 may be thedistance Z₃ plus the thickness H₇, and the distance between the firstsubstrate 102 and the second substrate 112 that corresponds to thesecond portion 20 may be the distance Z₄ plus the thickness H₇. The sumof the distance Z₃ and the thickness H₇ is less than that of thedistance Z₄ and the thickness H₇. In other embodiments, the adjustmentunit 204 b may have the thickness H_(g), and the adjustment unit 206 bmay have the thickness H₉. As shown in FIG. 6, the thickness H₉ may begreater than the thickness H_(g). In this embodiment, the distancebetween the first substrate 102 and the second substrate 112 thatcorresponds to the first portion 10 is substantially equal to thethickness H_(g), and the distance between the first substrate 102 andthe second substrate 112 that corresponds to the second portion 20 issubstantially equal to the thickness H₉, which is greater than thethickness H_(g).

Many variations and/or modifications can be made to embodiments of thedisclosure. Refer to FIG. 7, which illustrates a cross-sectional view ofthe electronic modulating device 300 in accordance with some embodimentsof the present disclosure. The electronic modulating device 300 may bethe same as or similar to that of the electronic modulating device 100,and one of the differences is that the adjustment units 104 are replacedby adjustment units 304, and the adjustment units 106 are replaced byadjustment units 306. As shown in FIG. 9, the adjustment unit 304includes a plurality of spacers 308, and the adjustment unit 306includes a plurality of spacers 310. The material of the spacer 308 andthe spacer 310 may be the same as or similar to that of the adjustmentunit 104 and the adjustment unit 106, respectively, and is not repeatedherein. In other embodiments, the material of the spacer 308 may bedifferent from that of the spacer 310. FIG. 7 illustrates the adjustmentunit 304 includes two spacers 308, and the adjustment unit 306 includestwo spacers 310. In other embodiments, the adjustment unit 304 mayinclude more than one spacer 308, and the adjustment unit 306 mayinclude more than one spacers 310. The number of spacers 308 per unitarea may be different from the number of spacers 310 per unit area. Forexample, the number of spacers 308 per unit area may be greater than orless than the number of spacers 310 per unit area. The unit area may be,but is not limited to, a rectangle region of 5 cm×5 cm, 3 cm×3 cm, 1cm×1 cm or another suitable region. In this embodiment, there are tworecovering forces F₁ pushing on the second substrate 112 in the regionthat corresponds to the first portion 10, and there are two secondrecovering forces F₂ pushing on the second substrate 112 in the regionthat corresponds to the second portion 20. Since the second recoveringforce F₂ is greater than the first recovering force F₁, the distancedifference between the first portion 10 of the first substrate 102 andthe second substrate 112 is less than that between the second portion 20of the first substrate 102 and the second substrate 112 when theelectronic modulating device 300 is heated causing the volume changes.

In other embodiments, the adjustment unit 304 may include a plurality ofspacers 308 whose elastic constant is respectively K_(n1), K_(n2),K_(n3), and so on; compressed length is respectively X_(n1), X_(n2),X_(n3), and so on. The adjustment unit 306 may include a plurality ofspacers 310 whose elastic constant is respectively K_(m1), K_(m2),K_(m3), and so on; compressed length is respectively X_(m1), X_(m2),X_(m3), and so on. A portion of the compressed length and/or the elasticcoefficient may be different. The number of spacers 308 may be differentfrom the number of spacers 310 The recovering force of the adjustmentunit 304 may be “K_(n1)X_(n1)+K_(n2)X_(n2)+K_(n3)X_(n3)+ . . . ”; therecovering force of the adjustment unit 306 may be“K_(m1)X_(m1)+K_(m2)X_(m2)+K_(m3)X_(m3)+ . . . ” The recovering force ofthe adjustment unit 304 may less than the recovering force of theadjustment unit 306.

Refer to FIGS. 8A and 8B, FIG. 8A illustrates a cross-sectional view ofthe first portion 10 of an electronic modulating device 500, and FIG. 8Billustrates a cross-sectional view of the second portion 20 of theelectronic modulating device 500 in accordance with some embodiments ofthe present disclosure. The electronic modulating device 500 shown in

FIGS. 8A and 8B is merely exemplary, and the scope of the disclosure isnot intended to be limited. For brevity, some elements are omitted inFIGS. 8A and 8B. In some embodiments, the elements illustrated in FIGS.8A and 8B may be omitted. The first portion 10 of the electronicmodulating device 500 may correspond to the first portion 10 of theelectronic modulating device 100, 200 or 300. The second portion 20 ofthe electronic modulating device 500 may correspond to the secondportion 20 of the electronic modulating device 100, 200 or 300.

As shown in FIGS. 8A and 8B, the electronic modulating device 500 mayinclude a substrate 502. The substrate 502 may be used to let theworking device or other elements dispose thereon. The substrate 502 mayinclude, but is not limited to, glass substrate, ceramic substrate,polymer substrate or another suitable substrate. The electronicmodulating device 500 may include an insulating layer 504 and aprotective layer 506. The insulating layer 504 may be disposed on thesubstrate 502, and the protective layer 506 may be disposed on theinsulating layer 504. The material of the insulating layer 504 mayinclude, but is not limited to, silicon oxide, silicon nitride oranother suitable dielectric material. The material of the protectivelayer 506 may include, but is not limited to, phosphosilicate glass(PSG), borophosphosilicate glass (BPSG), low dielectric constant (low-k)material, or another suitable material. The low dielectric constantdielectric materials may include, but are not limited to, fluorinatedsilica glass (FSG), carbon doped silicon oxide, amorphous fluorinatedcarbon, parylene, bis-benzocyclobutenes (BCB), polyimides, or anothersuitable material.

As shown in FIG. 8A, there is at least one working device 540 that isformed on the first portion 10 of the substrate 502. The working device540 may include a driving element 508, a first electrode 522, a secondelectrode 524 and a modulating material layer 526.

In some embodiments, the driving element 508 may include a thin filmtransistor (TFT). In some embodiments, the driving element 508 mayinclude a source electrode 510, a drain electrode 512, a gate electrode514 and an active layer 516. The gate electrode 514 may include, but isnot limited to, polysilicon, metal or another conductive material. Themetal may include, but is not limited to, copper (Cu), aluminum (Al),molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni),platinum (Pt), titanium (Ti). The material of the active layer 516 mayinclude amorphous semiconductor, poly-semiconductor and/or metal oxide.The semiconductor may include, but is not limited to, germanium (Ge),silicon (Si), tin (Sn), antimony (Sb), selenium (Se) or tellurium (Te).The metal oxide may include, but is not limited to, indium gallium zincoxide (IGZO), indium zinc oxide (IZO), indium gallium zinc oxide(IGZTO). The source electrode 510 and the drain electrode 512 aredisposed on the insulating layer 504 and on two sides of the gateelectrode 514. In addition, the material of the drain electrode 512 andthe source electrode 510 may include metal, such as copper (Cu),aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr),nickel (Ni), platinum (Pt), titanium (Ti). The active layer 516 mayinclude a channel region 518 that is disposed between the sourceelectrode 510 and the drain electrode 512. As shown in FIG. 8B, theworking device 540 does not be disposed in the second portion 20.

FIG. 8A illustrates that the gate electrode 514 is disposed under theinsulating layer 504. Many variations and/or modifications can be madeto embodiments of the disclosure. In some embodiments, the gateelectrode 514 may be disposed above the active layer 516; the gateelectrode 514 may have two portions, the first portion is disposed onthe substrate 502, and the second portion is disposed on the protectivelayer 506. However, the scope of the disclosure is not intended to belimited.

As shown in FIG. 8A, in the first portion 10, the electronic modulatingdevice 500 may include a conductive wire 520, the first electrode 522,the second electrode 524 and the modulating material layer 526. Thematerial of the conductive wire 520, the first electrode 522 and thesecond electrode 524 may include metal, metal oxide and another suitableconductive material.

As shown in FIG. 8A, the modulating material layer 526 is disposedbetween the first electrode 522 and the second electrode 524. In someembodiments, the first electrode 522 and/or the second electrode 524 maybe patterned and have multiple openings. The electronic field, betweenthe first electrode 522 and the second electrode 524, may affect thestatus of the modulating material layer 526. In some embodiments, thefirst electrode 522 and/or the second electrode 524 may not extend tothe second portion 20. In some embodiments, the first electrode 522and/or the second electrode 524 may extend to the second portion 20.

In addition, the electronic modulating device 500 may include a displayelement layer 528 and/or a substrate 530. The display element layer 528may be disposed on the second electrode 524. The display element layer528 may include, but is not limited to, a light filter layer, a lightshielding layer, a protective layer and/or other elements. The substrate530 may include, but is not limited to, glass substrate, ceramicsubstrate, polymer substrate or another suitable substrate. In someembodiments, the electronic modulating device 500 may include anelectromagnetic element (not shown), which is used to emit and/orreceive electromagnetic signal.

In some embodiments, the electronic modulating device 500 may include anadjustment unit 532 and an adjustment unit 534 in the first portion 10.As shown in FIG. 8A, the adjustment unit 532 and the adjustment unit 534may be disposed between the substrate 502 and the substrate 530. In someembodiments, the electronic modulating device 500 may include theadjustment unit 534 and an adjustment unit 536 in the second portion 20.As shown in FIG. 8B, the adjustment unit 534 and the adjustment unit 536may be disposed between the substrate 502 and the substrate 530. In someembodiments, the adjustment unit 532, the adjustment unit 534 and theadjustment unit 536 may correspond to the adjustment unit 104 a, theadjustment unit 108 and the adjustment unit 106 a, respectively.However, the scope of the disclosure is not intended to be limited.

According to some embodiments of the present disclosure, the electronicmodulating device may include the first adjustment unit that has thefirst recovering force per unit area and the second adjustment unit thathas the second recovering force per unit area.

The second recovering force is greater than the first recovering force.The unit area may be, but is not limited to, a rectangle region of 5cm×5 cm, 3 cm×3 cm, 1 cm×1 cm or another suitable region. The firstadjustment unit may be disposed on the region on which the workingdevices are disposed. The second adjustment unit may be disposed on theregion on which the working device is not disposed. When the volume ofthe electronic modulating device changes, the distance between twosubstrates in the region that has greater recovering force may changemore quickly or greatly. In the present disclosure, the distance betweentwo substrates in the region that has the working devices may changemore slowly or slightly. Therefore, the stability of the electronicmodulating device may be improved. In some embodiments, the recoveringforce of the adjustment unit may be controlled by changing its elasticcoefficient, material, the number of spacers, compressed length orthickness, density, another suitable parameter, or a combinationthereof. In addition, the elastic coefficient may indicate springconstant or Young's modulus. However, the scope of the disclosure is notintended to be limited. In the present disclosure, the parametersmentioned above may be measured before assembly or after the electronicmodulating device has been detached. The electronic modulating device ofthe present disclosure may be used in a display device, an antennadevice, an automotive device, a touch device, a sensor device, anotherdevice, or a combination thereof.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. Moreover, each of the claims constitutes an individualembodiment, and the scope of the disclosure also includes the scope ofthe various claims and combinations of the embodiments.

What is claimed is:
 1. An electronic modulating device, comprising: afirst substrate comprising a first portion and a second portion; asecond substrate disposed opposite to the first substrate; at least oneworking device disposed between the first substrate and the secondsubstrate, wherein the at least one working device overlaps the firstportion and does not overlap the second portion; a first adjustment unitdisposed between the first portion of the first substrate and the secondsubstrate, wherein the first adjustment unit has a first elasticcoefficient; and a second adjustment unit disposed between the secondportion of the first substrate and the second substrate; wherein thesecond adjustment unit has a second elastic coefficient, and the firstelastic coefficient is less than the second elastic coefficient.
 2. Theelectronic modulating device according to claim 1, further comprising: athird adjustment unit disposed between the first substrate and thesecond substrate, wherein the third adjustment unit has a third elasticcoefficient, and the third elastic coefficient is greater than thesecond elastic coefficient.
 3. The electronic modulating deviceaccording to claim 2, wherein the third adjustment unit is disposedbetween the first adjustment unit and the second adjustment unit.
 4. Theelectronic modulating device according to claim 1, wherein a distancebetween the second portion of the first substrate and the secondsubstrate is greater than a distance between the first portion of thefirst substrate and the second substrate.
 5. The electronic modulatingdevice according to claim 1, further comprising: a working region and anon-working region, wherein the second adjustment unit is disposed onthe non-working region.
 6. The electronic modulating device according toclaim 1, further comprising: a working region and a non-working region,wherein the first adjustment unit is disposed on the working region. 7.The electronic modulating device according to claim 1, wherein amaterial of the first adjustment unit is different from a material ofthe second adjustment unit.
 8. The electronic modulating deviceaccording to claim 1, wherein the first adjustment unit comprises aplurality of first spacers, the second adjustment unit comprises aplurality of second spacers, and a number of the plurality of firstspacers per unit area is less than a number of the plurality of secondspacers per unit area.
 9. The electronic modulating device according toclaim 1, further comprising: a modulating material layer disposedbetween the first substrate and the second substrate, wherein themodulating material layer fills a gap between the first adjustment unitand the second adjustment unit.
 10. The electronic modulating deviceaccording to claim 1, wherein a material of the first adjustment unitand the second adjustment unit comprises photoresist.
 11. An electronicmodulating device, comprising: a first substrate comprising a firstportion and a second portion; a second substrate disposed opposite tothe first substrate; at least one working device disposed between thefirst substrate and the second substrate, wherein the at least oneworking device overlaps the first portion and does not overlap thesecond portion; a first adjustment unit disposed between the firstportion of the first substrate and the second substrate, wherein thefirst adjustment unit has a first thickness; and a second adjustmentunit disposed between the second portion of the first substrate and thesecond substrate, wherein the second adjustment unit has a secondthickness; wherein the first thickness is less than the secondthickness.
 12. The electronic modulating device according to claim 11,further comprising: a working region and a non-working region, whereinthe first adjustment unit is disposed on the working region.
 13. Theelectronic modulating device according to claim 11, further comprising:a third adjustment unit disposed between the first substrate and thesecond substrate, wherein the third adjustment unit has a thirdthickness, and the third thickness is less than the first thickness. 14.The electronic modulating device according to claim 13, wherein thethird adjustment unit is disposed between the first adjustment unit andthe second adjustment unit.
 15. The electronic modulating deviceaccording to claim 13, wherein the third adjustment unit overlaps thefirst portion and the second portion.
 16. The electronic modulatingdevice according to claim 11, wherein a distance between the secondportion of the first substrate and the second substrate is greater thana distance between the first portion of the first substrate and thesecond substrate.
 17. The electronic modulating device according toclaim 11, further comprising: a modulating material layer disposedbetween the first substrate and the second substrate, wherein themodulating material layer fills a gap between the first adjustment unitand the second adjustment unit.
 18. The electronic modulating deviceaccording to claim 11, wherein a material of the first adjustment unitand the second adjustment unit comprises photoresist.
 19. The electronicmodulating device according to claim 11, wherein the working deviceincludes a thin film transistor.
 20. The electronic modulating deviceaccording to claim 11, wherein a material of the first adjustment unitis the same as a material of the second adjustment unit.